Device protection and contamination control begins at the wafer fab and extends to the assembly site. ePAK never forgets that the most valuable product in the semiconductor and electronics industry is also the most fragile and susceptible to mishandling and contamination. Not all wafers are created equal…with back-grinding, unique material sets, and exotic semiconductor processes, one product does not fit all wafers. From ePAK's most advanced eLX wafer canisters to cost efficient wafer jars, ePAK tailor fits our products to meet your requirements.
(Front Opening Shipping Box – 300mm wafers)
ePAK Offers the Full Set of Inter Carrier Materials
Interleaf or Wafer Separators
Cushion Disks & Edge Protector
Closed Cell Foam (Conductive and Anti-Static Materials)
ePAD® cushioning (high purity replacement to foam)
The ultimate in wafer shipping. ePAK’s patented design combines the best performance features of vertical cassettes and old style coin-stack shippers
Best overall wafer protection with the lowest cost of ownership in the industry
Ultimate in wafer breakage protection
Bond pad and bump integrity through zero-inter-wafer movement feature
Interfaces with leading automated equipment
Engineered for the vertical shipping of 25 wafers per box
Available in 4”, 5”, 6” & 8” sizes
Multiple designs of cushions and cassette slot sizes
Ultra clean Materials to meet your specification
In Process handling of wafers with standard machine interface
Full range of materials to meet your In-Process needs
Custom designs available
Metal & Plastic Flex Frames and Shippers
Full Range of sizes and materials
Vacuum-formed & Injection molded Shippers
Single and Multiple Frame shipper designs available
Full Range of sizes, custom colors available
Vacuum-formed single Shippers
Injection Molded Multishippers
For 1, 2, 3, 4, 5, 6, 8, and 12 inch inch wafers, up to the 450mm wafer, ePAK has industry approved Coinstyle or Clamshell solutions.
Horizontal “coin stack” type shippers.
Container shipping products designed to protect your enclosed devices while in transit.
Many designs and matrix available
Custom designs can be done to meet your shipping requirements
A full range of Jar sizes and foam inserts are available.
Revolutionary cushioning option replaces dirty foams to form a system eliminating corrosion and organic contaminants
Patented adjustable spacer option that enhances wafer protection by controlling packing process variability and minimizing vertical movement.
Our catalog covers a wide range of products specifically tailored to handling your wafers. Please contact us if you need custom solutions to your projects.