Device protection and contamination control begins at the wafer fab and extends to the assembly site. ePAK never forgets that the most valuable product in the semiconductor and electronics industry is also the most fragile and susceptible to mishandling and contamination. Not all wafers are created equal…with back-grinding, unique material sets, and exotic semiconductor processes, one product does not fit all wafers. From ePAK's most advanced eLX wafer canisters to cost efficient wafer jars, ePAK tailor fits our products to meet your requirements.
Introduction to Enhanced Wafer Handling with ePAK’s Front Opening Shipping Box (eFOSB)
The ePAK eFOSB (Front Opening Shipping Box) enhances 300mm wafer handling and shipping for semiconductor manufacturing. Compliant with SEMI/FIMS and AMHS standards, this FOSB ensures superior protection during transport and storage. The eFOSB features a 25-slot capacity for 300mm wafers with precision spacing, automated operations, and a manual handling option. Crafted from ultra-clean, low-outgassing materials with a robust wafer retention system, it minimizes contamination risks and particle generation, preserving wafer integrity. This FOSB offers immediate availability, streamlined production, and customization options, making it ideal for semiconductor manufacturers seeking to optimize their wafer handling and shipping processes.
Introduction to Enhanced Wafer Handling with ePAK’s eFOUP
In the semiconductor industry, efficient and safe wafer handling is crucial for maintaining high production yields and ensuring the integrity of delicate wafers. ePAK’s eFOUP (Front Opening Unified Pod) is designed to meet these stringent requirements by providing robust protection and easy access to wafers during transport and storage. The essential need for an automated material handling system (AMHS) to transport FOUPs in semiconductor fabrication facilities cannot be overstated, as it ensures the safe and efficient movement of these critical storage units.
ePAK Offers the Full Set of Inter Carrier Materials
Interleaf or Wafer Separators
High-Purity
Conductive materials
Tyvek® Interleaf
Cushion Disks & Edge Protector
Closed Cell Foam (Conductive and Anti-Static Materials)
ePAD® cushioning (high purity replacement to foam)
The ultimate in wafer shipping. ePAK’s patented design combines the best performance features of vertical cassettes and old style coin-stack shippers
Best overall wafer protection with the lowest cost of ownership in the industry
Ultimate in wafer breakage protection
Bond pad and bump integrity through zero-inter-wafer movement feature
Interfaces with leading automated equipment
Engineered for the vertical shipping of 25 wafers per box
Available in 4”, 5”, 6” & 8” sizes
Multiple designs of cushions and cassette slot sizes
Ultra clean Materials to meet your specification
In Process handling of wafers with standard machine interface
Full range of materials to meet your In-Process needs
Custom designs available
Metal & Plastic Flex Frames and Shippers
Full Range of sizes and materials
Vacuum-formed & Injection molded Shippers
Single and Multiple Frame shipper designs available
Full Range of sizes, custom colors available
Vacuum-formed single Shippers
Injection Molded Multishippers
For 1, 2, 3, 4, 5, 6, 8, and 12 inch inch wafers, up to the 450mm wafer, ePAK has industry approved Coinstyle or Clamshell solutions.
Horizontal “coin stack” type shippers.
Container shipping products designed to protect your enclosed devices while in transit.
Many designs and matrix available
Custom designs can be done to meet your shipping requirements
A full range of Jar sizes and foam inserts are available.
Revolutionary cushioning option replaces dirty foams to form a system eliminating corrosion and organic contaminants
Patented adjustable spacer option that enhances wafer protection by controlling packing process variability and minimizing vertical movement.
Our catalog covers a wide range of products specifically tailored to handling your wafers. Please contact us if you need custom solutions to your projects.