eGaN

ePOD PRO

Modular FOUP System

eSiC: Silicon Carbide Wafer Handling

Ensuring Reliability in High-Performance Silicon Carbide Applications

Introduction to eSiC Wafer Handling Solutions

As silicon carbide (SiC) technology continues to drive advancements in high-temperature and high-frequency devices, ePAK’s eSiC wafer handling solutions offer critical protection and precise handling for silicon carbide wafers in applications such as power electronics, renewable energy systems, and electric vehicles.

Our eSiC solutions are meticulously engineered for SiC wafers, offering advanced protection against surface defects, contamination, and physical stress. This ensures greater efficiency and superior performance in the semiconductor industry and enhances the reliability of SiC-based devices in demanding conditions.

As a material, silicon carbide is valued for its high-temperature resilience, excellent thermal conductivity, and robust structural integrity. However, SiC wafers also require careful handling to avoid damage during manufacturing and transport stages.

ePAK’s eSiC solutions offer tailored protection to meet these needs, enabling safer, contamination-free handling across each stage of silicon carbide wafer processing. Our comprehensive solutions support SiC production from boule growth to wafer dicing and final packaging.

FOSB 300mm Wafer Carrier

What is a FOSB? The Industry Standard for 300mm Wafer Shipping

A FOSB (Front Opening Shipping Box) is a SEMI-standard carrier designed for the safe transport of 300mm semiconductor wafers between fabrication facilities. Unlike a FOUP (Front Opening Unified Pod), which is used for in-fab wafer handling, a FOSB is purpose-built for inter-fab shipping — protecting wafers from contamination, mechanical damage, and electrostatic discharge during long-distance transport.

The ePAK eFOSB300-A is a SEMI/FIMS-compliant FOSB with 25 slots, a pre-installed filter, and full AMHS compatibility. Crafted from ultrapure, low-outgassing materials with a robust wafer retention system, it minimizes contamination risks and particle generation while preserving wafer integrity. Immediate availability, streamlined production, and customization options make the eFOSB300-A ideal for semiconductor manufacturers seeking to optimize their wafer shipping processes.

FOUP 300mm Wafer Carrier

What is a FOUP? The Standard Carrier for 300mm In-Fab Wafer Transport

A FOUP (Front Opening Unified Pod) is a SEMI-standard carrier used to transport and store 300mm semiconductor wafers within a fabrication facility. FOUPs interface directly with load ports and automated material handling systems (AMHS), enabling contamination-free wafer transfer between process tools in a cleanroom environment.

The ePAK eFOUP is a SEMI/FIMS-compliant 300mm FOUP with 25 slots, multiple purge options, and full AMHS compatibility. Built from ultrapure, low-outgassing materials with a robust wafer retention system, the eFOUP minimizes particle generation and contamination risk throughout in-fab transport and storage.

Need to handle multiple wafer formats in a single carrier? View the modular eFOUP-C system with six configurable inserts for 300mm, 200mm, film frames, and probe cards.

Wafer Interface Materials

ePAK Offers the Full Set of Inter Carrier Materials

• Interleaf or Wafer Separators

• High-Purity

• Conductive materials

• Tyvek® Interleaf

• Cushion Disks & Edge Protector

• Closed Cell Foam (Conductive and Anti-Static Materials)

• ePAD® cushioning (high purity replacement to foam)

eLX™ Zero-Movement Canisters

The ultimate in wafer shipping. ePAK’s patented design combines the best performance features of vertical cassettes and old style coin-stack shippers

• Best overall wafer protection with the lowest cost of ownership in the industry

• Ultimate in wafer breakage protection

• Bond pad and bump integrity through zero-inter-wafer movement feature

• Interfaces with leading automated equipment

ePRO™ Shipping Boxes

Engineered for the vertical shipping of 25 wafers per box

• Available in 4”, 5”, 6” & 8” sizes

• Multiple designs of cushions and cassette slot sizes

• Ultra clean Materials to meet your specification

Process Boats and Boxes

In Process handling of wafers with standard machine interface

• Full range of materials to meet your In-Process needs

• Custom designs available

Flex Frames and Shippers

Metal & Plastic Flex Frames and Shippers

• Full Range of sizes and materials

• Vacuum-formed & Injection molded Shippers

• Single and Multiple Frame shipper designs available

Hoop Rings and Shippers

Full Range of sizes, custom colors available

• Vacuum-formed single Shippers

• Injection Molded Multishippers

Single Wafer Shippers

For 1, 2, 3, 4, 5, 6, 8, and 12 inch inch wafers, up to the 450mm wafer, ePAK has industry approved Coinstyle or Clamshell solutions.

eCT Standard Wafer Canisters

Horizontal “coin stack” type shippers.

• Enhanced protection for standard and thinned wafers

• Sizeable savings from increased packing density

OverPaks™

Container shipping products designed to protect your enclosed devices while in transit.

• Many designs and matrix available

• Custom designs can be done to meet your shipping requirements

eJR Wafer Jars

A full range of Jar sizes and foam inserts are available.

• Maximum Packing Density

• Lowest Cost Wafer Handling

ePAD™

Revolutionary cushioning option replaces dirty foams to form a system  eliminating corrosion and organic contaminants

eFORM™

Patented adjustable spacer option that enhances wafer protection by controlling packing process variability and minimizing vertical movement.