eFOSB300-A

(Front Opening Shipping Box – 300mm wafers)

• SEMI/FIMS compliant
• Automated operation minimizes potential contamination from human interaction
• Manual opening and closing
• Ultrapure, low outgassing materials protect wafers
• Robust wafer retention ensures reduced particle generation
• Cleanable without requiring disassembly of door

Wafer Interface Materials

ePAK Offers the Full Set of Inter Carrier Materials

• Interleaf or Wafer Separators

• High-Purity

• Conductive materials

• Tyvek® Interleaf

• Cushion Disks & Edge Protector

• Closed Cell Foam (Conductive and Anti-Static Materials)

• ePAD® cushioning (high purity replacement to foam)

eLX™ Zero-Movement Canisters

The ultimate in wafer shipping. ePAK’s patented design combines the best performance features of vertical cassettes and old style coin-stack shippers

• Best overall wafer protection with the lowest cost of ownership in the industry

• Ultimate in wafer breakage protection

• Bond pad and bump integrity through zero-inter-wafer movement feature

• Interfaces with leading automated equipment

ePRO™ Shipping Boxes

Engineered for the vertical shipping of 25 wafers per box

• Available in 4”, 5”, 6” & 8” sizes

• Multiple designs of cushions and cassette slot sizes

• Ultra clean Materials to meet your specification

Process Boats and Boxes

In Process handling of wafers with standard machine interface

• Full range of materials to meet your In-Process needs

• Custom designs available

Flex Frames and Shippers

Metal & Plastic Flex Frames and Shippers

• Full Range of sizes and materials

• Vacuum-formed & Injection molded Shippers

• Single and Multiple Frame shipper designs available

Hoop Rings and Shippers

Full Range of sizes, custom colors available

• Vacuum-formed single Shippers

• Injection Molded Multishippers

Single Wafer Shippers

For 1, 2, 3, 4, 5, 6, 8, and 12 inch inch wafers, up to the 450mm wafer, ePAK has industry approved Coinstyle or Clamshell solutions.

eCT Standard Wafer Canisters

Horizontal “coin stack” type shippers.

• Enhanced protection for standard and thinned wafers

• Sizeable savings from increased packing density

OverPaks™

Container shipping products designed to protect your enclosed devices while in transit.

• Many designs and matrix available

• Custom designs can be done to meet your shipping requirements

eJR Wafer Jars

A full range of Jar sizes and foam inserts are available.

• Maximum Packing Density

• Lowest Cost Wafer Handling

ePAD™

Revolutionary cushioning option replaces dirty foams to form a system  eliminating corrosion and organic contaminants

eFORM™

Patented adjustable spacer option that enhances wafer protection by controlling packing process variability and minimizing vertical movement.