FOSB: Reliable 300mm Wafer Transport Between Fabs
The ePAK eFOSB300-A is a 300mm FOSB wafer carrier purpose-built for silicon wafer transportation between fabrication facilities. With 25 slots at 10mm pitch, a pre-installed filter, and SEMI/FIMS compliance, this FOSB provides controlled protection from fab to fab.
Semiconductor manufacturing demands absolute wafer integrity during every stage of transport. The eFOSB300-A, one of ePAK’s FOSB semiconductor solutions for inter-fab wafer logistics, addresses this requirement as a purpose-engineered wafer shipping container with robust mechanical design and ultrapure, low-outgassing material construction. Each unit holds 25 silicon wafers at a consistent 10mm pitch with ±0.5mm non-cumulative spacing accuracy, conforming to SEMI specifications for reliable automated retrieval.
As a 300mm wafer shipping box, the eFOSB300-A integrates directly with automated material handling systems through its top-mounted robotic flange and kinematic coupling features. The robotic flange is molded from eM-157, a carbon fiber filled polycarbonate achieving 10⁴ to 10⁷ ohms/sq surface resistivity per ASTM D-257. A pre-installed particle filter and sealed front door protect wafer surfaces from airborne contamination during transit.
The SEMI-compliant FOSB supports both automated and manual operation, with a door that cleans without disassembly. Unlike standard wafer handling boxes or cassettes, the eFOSB300-A provides full enclosure for protected long-distance transport. ePAK offers multiple standard configurations with options for particle filters, D-Ring attachments, info tag plates, and finish types, and tailors custom configurations to match specific facility requirements. Units are available for immediate shipment, supporting rapid wafer delivery without extended lead times.
Looking for in-fab wafer handling instead of inter-fab shipping? Compare FOSB vs FOUP carriers to find the right solution for your process.
