One FOUP Platform for Every Wafer Format
The eFOUP-C is ePAK's modular FOUP system, a configurable 300mm wafer carrier designed to unify wafer transport for fabs managing 200mm wafers, 300mm wafers, and film frames within a single carrier platform.
Semiconductor fabs increasingly handle multiple wafer formats across their production lines. The Modular FOUP addresses this challenge with a single 300mm shell and a precision-molded, application-specific insert selected at order and permanently installed during assembly. Six dedicated configurations support standard or thinned 300mm wafers, 200mm wafers, 276mm film or tape frames, and probe cards while maintaining the same external dimensions and automation interfaces. This lets fabs handle 200mm wafers within a standard 300mm FOUP footprint; inserts are not changed in the field.
The Modular FOUP preserves full SEMI/FIMS compliance, including SEMI E47.1, E57, and E62 interfaces for repeatable load-port placement. Existing AMHS infrastructure, overhead hoists, automated guided vehicles, and stockers work without modification regardless of the installed configuration. The static dissipative carbon-fiber polycarbonate shell and PEEK door components provide ESD protection and low outgassing across all configurations.
With six build-to-order configurations and options for handles, RFID integration, card holders, and rear-window variants, ePAK tailors each eFOUP-C system to match specific process requirements. Looking for a standard carrier dedicated to bare 300mm wafers? View the ePAK 300mm FOUP wafer carrier. Contact ePAK to discuss which Modular FOUP configuration best fits your fab’s multi-format handling needs.
