eFOUP Wafer Handling

Introduction to Enhanced Wafer Handling with ePAK’s eFOUP

In the semiconductor industry, efficient and safe wafer handling is crucial for maintaining high production yields and ensuring the integrity of delicate wafers. ePAK’s eFOUP (Front Opening Unified Pod) is designed to meet these stringent requirements by providing robust protection and easy access to wafers during transport and storage. The essential need for an automated material handling system (AMHS) to transport FOUPs in semiconductor fabrication facilities cannot be overstated, as it ensures the safe and efficient movement of these critical storage units.

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Overview of eFOUP Technology

Key Features

SEMI/FIMS compliant
AMHS compliant
Automated operation minimizes potential contamination from human interaction
Automation compatibility for opening and closing
Ultrapure, low outgassing materials protect wafers
Robust wafer retention ensures reduced particle generation
Multiple purge position options
Multiple handle options
Multiple window options
Coupling plates for positioning the FOUP on a load port and enabling transfer by the AMHS

eFOUP Specifications

Wafer size – 300mm
Capacity – 25 slot
All datums established relative to kinematic coupling per SEMI
Wafer spacing – 10mm (+/-0.5mm wafer-to-wafer, non-cumulative)
Weight (empty) – 4.6 kg; 25 wafer loaded in, about 7.8kg
Overall size w/ handles and robotic flange : W420 X L342 X H338(mm)
Overall size w/o handles and robotic flange : W388 X L342 X H332(mm)

Features of eFOUP

Environmental Control and Purge Options

Purge Systems: Offers purge options with two or four ports to maintain inert atmosphere conditions, replacing ambient air with nitrogen to protect wafers from oxidative damage. Additionally, a FOUP stocker can be used for managing and storing FOUPs, applying purge gas to increase device yield.

While FOUPs are designed for 300mm wafers, SMIF pods are suitable for wafers with dimensions smaller than 300mm. Both systems play a crucial role in maintaining cleanliness and reducing particle contamination during the handling of silicon wafers.

ESD Protection: Integrated features for electrostatic discharge protection, critical for maintaining the integrity of wafers during storage and transport.

Frequently asked questions

What is a FOUP?

The FOUP (also called the Front Opening Universal pod or Front Opening Unified Pod) is the first reusable crystalline plastic that has been designed to securely transport silicon wafers and to transfer wafers between machines for processing. FOUPs are equipped with secure door mechanisms that facilitate safe handling and transport of wafers, ensuring cleanliness and preventing contamination during the fabrication process.

The manufacturing process of FOUPs is crucial in safeguarding semiconductor wafers from contamination and damage during semiconductor wafer manufacturing.

What is the difference between FOUP (front opening unified pod) and a FOSB (front opening shipping box)?

FOUP (Front Opening Unified Pouch) and FOSB (Front Opening Shipping Box) are used to transport wafers during semiconductor production. FOUP is generally used in the internal transport and manufacturing process, while the FOSB is used in the shipping and external transport of wafers. FOUPs are designed with specific holes that enable them to interface effectively with Automated Material Handling Systems (AMHS) for the transportation of semiconductor wafers.

How many wafers can a FOUP hold?

Typically, a FOUP holds 25 wafers.

What is the difference between FOUP and SMIF pods?

FOUP (Front Opening Unified Pod) and SMIF (Standard Mechanical Interface) pods are two essential components. While both serve the purpose of safely storing and transporting wafers, there are significant differences between the two.

A wafer FOUP is a specialized container designed to safely transport 300mm silicon wafers within automated material handling systems (AMHS). FOUP is specifically designed to accommodate 300mm wafers, which have become the standard in modern semiconductor manufacturing. The increased size and flexibility of 300mm wafers made it challenging to apply the same SMIF technology and design used for smaller wafers. As a result, the FOUP was developed to address the unique requirements of handling 300mm wafers.

SMIF Pods: Ideal for Wafers Less Than 300mm

In contrast, SMIF pods are suitable for wafers with dimensions smaller than 300mm. These pods have been widely used in the semiconductor industry for many years and have proven to be effective in protecting and transporting wafers during the manufacturing process.

SMIF Pods: Ideal for Wafers Less Than 300mm

In contrast, SMIF pods are suitable for wafers with dimensions smaller than 300mm. These pods have been widely used in the semiconductor industry for many years and have proven to be effective in protecting and transporting wafers during the manufacturing process.

Wafer Shipping & Handling Catalog

Our catalog covers a wide range of products specifically tailored to handling your wafers. Please contact us if you need custom solutions to your projects.

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