A Common 300mm FOUP Platform for Wafer Integrity and Automation
The ePAK eFOUP is a sealed 300mm Front Opening Unified Pod (FOUP) wafer carrier built on a single PC+CF shell, specialized into three configurations that match general fab work, enhanced N2 purge control, and moisture sensitive process flows.
Wafer carriers in a 300mm fab spend most of their service life inside an Automated Material Handling System. They travel between load ports, stockers, and overhead transport, and they must hand off to robotic flanges and kinematic couplers thousands of times without drifting out of SEMI tolerance. The eFOUP platform is engineered around that reality. Every variant uses the same external footprint of 420 by 342 by 338 millimeters with handle and robotic flange, the same kinematic coupling reference, and the same 44 millimeter first-wafer datum, so the family is interchangeable in any AMHS path that already accepts a SEMI E47.1 compliant FOUP.
From that shared base, ePAK offers three configurations. The two-port eFOUP300-A is the general-purpose 300mm FOUP for mainstream manufacturing environments. The four-port eFOUP300-AF adds two additional N2 purge ports for enhanced purge control during long queue times. The eFOUP300-DF replaces the PC+CF shell with a Low Moisture Absorption LMA+CF shell and adds integrated diffusers on its four purge ports, targeted at high sensitivity processes such as advanced node logic, advanced lithography, and high value advanced packaging where moisture, oxygen, and outgassing must be minimized.
Every configuration uses the same wafer protection discipline. Static dissipative materials at the shell, PEEK at every critical wafer contact area, controlled wafer pitch at 10mm with +/-0.5mm non-cumulative positional tolerance, and a wafer retention design that limits shock and vibration through transport. Each variant is engineered to enter an automatic washer with the door and internal components installed, so maintenance does not require disassembly. The result is one platform, three configurations, three order codes, and a single AMHS routing across every standard 300mm use case in the fab.
For non-standard wafer formats, including 200mm wafers in a 300mm path, 13-slot thin wafer transport, and 276×276 film frames, see the Modular FOUP System.
