eLX™ Zero-Movement Wafer Canister
Horizontal Coin-Stack Wafer Canister for 150 / 200 / 300mm Wafers

eLX™ Zero-Movement Wafer Canister

ePAK's patented horizontal coin-stack wafer canister for 150mm, 200mm and 300mm wafers. The eLX family covers 2-latch and 4-latch canisters with Fixed Height Ring Separators for thinned and bumped device wafer shipping.

  • Zero Inter-Wafer Movement
    Internal fingers lock the ring-separator stack against lateral travel when the lid seals, eliminating wafer-on-wafer sliding.
  • Bond Pad and Bump Integrity
    Wafers rest on raised ring-separator ridges at the non-critical outer edge only, so bumped, bonded and patterned surfaces stay clear of any separator contact.
  • ESD-Safe eM-01 Construction
    eM-01-BLK static dissipative ultra-clean polypropylene, surface resistivity 10⁴ to 10⁵ ohm, low outgassing, front-end and back-end cleanroom compatible.
  • Engineered Wafer Breakage Protection
    Impact-resistant enclosure with 4-latch (or 2-latch) closure and Fixed Height Ring Separators that control stack pressure on the wafer edges.
  • Lowest Cost of Ownership
    Reusable and built for high-cycle service. Drop-in compatible with existing automated packing lines, with ring separators and consumables supplied in bulk.
Two eLX Fixed Height Ring Separators showing the self-stacking edge-support design
Close-up of eLX zero-movement retention tabs that limit lateral wafer movement

Coin-Stack Density, Cassette-Grade Wafer Canister Protection

The eLX platform replaces the compromises of traditional coin-stack shippers with a patented ring-separator system engineered to eliminate inter-wafer movement during transport, across 150mm, 200mm, and 300mm wafers.

Horizontal coin-stack shippers have always offered better packing density than vertical cassettes, but the trade-off was wafer-to-wafer contact, lateral shifting under vibration, and the bond pad and bump damage that follows. The eLX Zero-Movement Canister was designed to remove that trade-off. Each wafer rests face down on the raised ridges of a ring separator sized to its diameter, so only the non-critical edge zone ever touches the carrier. When the lid is closed, internal fingers in the canister body adapt to the stack diameter and lock the ring stack against lateral travel.

The platform covers 150mm, 200mm and 300mm wafers in both short and tall enclosures, with two-latch and four-latch closures. The tall 200mm and 300mm canisters are dimensioned for full 25-wafer lots when paired with the appropriate ring separator. Self-stacking Fixed Height Ring Separators (FHRS) use outside stacking supports to set positive separation between wafers and to take stack-weight pressure off the wafer edges, which is critical for thinned, bumped and Taiko device wafers.

Because every part of the eLX is reusable and built for high-cycle service, the economics scale as well as the protection does. The canisters run on existing automated packing lines, ring separators and packing consumables ship in bulk, and OverPak outer shippers are available for international transit. The combination of engineered wafer protection, drop-in compatibility with installed packing lines, and broad coverage across 150mm, 200mm and 300mm wafers is what ePAK means by lowest cost of ownership in the wafer shipping category.

View Specifications
Product family

The complete eLX wafer shipping family

Canisters in 150mm, 200mm and 300mm, eLX-style wafer jars, and the ring separators, platforms and packing consumables that go with them. Add anything here to your quote and ePAK will confirm the exact configuration.

Canisters & containers

150mm eLX 150mm Canister
Coin-stack canister

eLX 150mm Canister

Zero-movement shipping for 150mm wafers

Each wafer rests face down on the outer edge of a ring separator, so only the non-critical edge zone is ever touched. When the lid closes, the cavity narrows to lock the stack against lateral movement. Available in short and tall (FHRS) styles.

  • 150mm
  • Short + tall (FHRS)
  • eM-01-BLK ESD-safe
200mm eLX 200mm Canister
Coin-stack canister

eLX 200mm Canister

Zero-movement shipping for 200mm wafers

Horizontal coin-stack canister for 200mm wafers with edge-only ring support and zero inter-wafer movement. Short and tall styles; the tall canister carries a full 25-wafer lot with ring separators.

  • 200mm
  • Up to 25 wafers (tall)
  • 2 or 4 latch
300mm eLX 300mm Canister
Coin-stack canister

eLX 300mm Canister

Zero-movement shipping for 300mm wafers

Horizontal coin-stack canister for 300mm wafers. Edge-only ring support keeps device surfaces clear and the closing geometry eliminates lateral travel. Short and tall (FHRS) styles; the tall canister carries a full 25-wafer lot.

  • 300mm
  • Up to 25 wafers (tall)
  • 4 latch
Jars eLX-style Wafer Jars
Low-volume shipping

eLX-style Wafer Jars

Patented zero-movement features in a jar

Low-cost jar system for 150mm and 200mm wafers. Patented eLX-style internal features reduce lateral movement without a foam liner. Suited to low-volume and partial-lot shipping.

  • 150mm + 200mm
  • No foam liner needed
  • eM-01-BLK

Separators, platforms & packing

Rings Ring Separators
Edge-only support

Ring Separators

Surface protection at coin-stack density

Ultra-clean conductive rings that support each wafer only on its outer edge, with no contact on the device surface. Standard rings set spacing from wafer thickness; Fixed Height Ring Separators (FHRS) interlock into a fixed cavity for the tall eLX, taking stack weight off the wafer edge for thinned, bumped and Taiko wafers.

  • 150 / 200 / 300mm
  • Standard + FHRS
  • Conductive PP
eFORM eFORM Adjustable Platforms
Top-fill platform

eFORM Adjustable Platforms

For varying lot sizes

A 16mm adjustable platform that compensates for partial-lot stack-height variation and simplifies packing when wafer counts vary per shipment. Works inside any eLX canister size.

  • 150 / 200 / 300mm
  • 16mm adjustable
  • 10 per pack
Foam & Tyvek Foam & Tyvek Contact Separators
Contact separator packing

Foam & Tyvek Contact Separators

Flat separators with axial cushioning

A flat contact separator in Tyvek, carbon or yellow paper between each wafer, with foam cushions top and bottom for cushioning. A complete alternative to rings when a flat contact interface is preferred.

  • 150 / 200 / 300mm
  • Tyvek / carbon / paper
  • Top + bottom foam
OverPak OverPak Outer Shippers
International transit

OverPak Outer Shippers

Outer protection for shipping

Outer shippers matched to each canister size, configured for international transit with added drop protection. Pairs with any eLX canister for full or partial lots.

  • Per canister size
  • Drop protection
  • Reusable

Engineered Wafer Protection Capabilities

Design features that distinguish the eLX platform from conventional coin-stack shippers.

Zero-Movement Retention

Internal fingers engage the ring-separator stack when the lid seals, and the cavity diameter reduces on close to lock the stack against lateral travel, eliminating inter-wafer sliding under shipping vibration.

Lateral retention: positive | Closing geometry: varying-diameter cavity

Edge-Only Wafer Contact

Ring separators contact wafers only on the non-critical outer edge. Bumps, redistribution layers and bond pads stay clear of any separator surface throughout transport.

Contact zone: outer edge only | Device-surface contact: zero

Fixed Height Ring System (FHRS)

Self-stacking FHRS rings interlock into a fixed cavity on the tall eLX, setting positive separation and carrying stack weight off the wafer edges. Preferred for thinned, bumped and Taiko wafers.

Tall eLX: 26 rings for up to 25 wafers | Compression on wafer: eliminated

eM-01 Material Construction

Canister bodies, lids and ring separators in eM-01-BLK static dissipative ultra-clean polypropylene with carbon powder. Low outgassing and compatible with front-end and back-end clean environments.

Surface resistivity: 10⁴ to 10⁵ ohm | Material: eM-01-BLK | RoHS compliant

Drop-in Coin-Stack Compatibility

Outside base dimensions match common industry coin-stack canister footprints, so the eLX runs on existing automated packing lines with ring separators, Tyvek or carbon interleaf.

Outside base: 174.5 / 225 / 326 mm | Industry packing-line compatible

Four-Latch Secure Enclosure

A four-latch closure distributes sealing force evenly across the wafer stack, more secure than two-latch systems, inside an impact-resistant housing with a dedicated impact-protection zone.

Closure: 2 or 4 latch | Impact-protection zone | Hold-down feature

Automation & Handling Features

Pin-orientation cylinders in six locations work with the orientation features of loading equipment, large top and side label areas read on automated packing lines, and a patented kinematic coupling groove aligns lid to base. An RFID component holder is built in.

Pin orientation: 6 locations | Label areas: top + side | Kinematic coupling groove

Typical Wafer Canister Applications

Where the eLX Zero-Movement Canister family fits in your wafer logistics chain.

Bumped and Patterned Wafer Shipping

Bumped and Patterned Wafer Shipping

Face-down ring contact on non-critical zones protects bumps, redistribution layers, and bond pads on processed device wafers during long-distance transit.

Thinned Wafer Transport

Thinned Wafer Transport

Fixed Height Ring Separators remove stack-weight pressure from delicate wafer edges, making the eLX suitable for thinned, back-ground, and TSV process flows.

Outsourced Assembly and Test

Outsourced Assembly and Test

Reusable canisters with OverPak outer shippers move full or partial lots to OSAT, probe, and inspection partners while maintaining lot integrity and ESD protection.

Compound Semiconductor Wafers

Compound Semiconductor Wafers

Static dissipative ultra-clean polypropylene and zero-movement retention support the careful handling required for SiC, GaN, and other compound semiconductor substrates.

Drop-in Replacement for Legacy Shippers

Drop-in Replacement for Legacy Shippers

Outside base dimensions match traditional coin-stack canister footprints, so the eLX runs on existing automated packing lines with Tyvek or carbon interleaf in addition to ring separators.

Compatibility & Integration

Standards, equipment, and consumables that work with the eLX family.

Industry Standards

  • Surface Resistivity 10⁴ to 10⁵ ohm (eM-01-BLK)
  • Low Outgassing Static Dissipative Polypropylene
  • RoHS Compliant Construction
  • Patented Design (US 6988620; PRC ZL03 2 07820 X; SG 106157; TW I299315; JP 4383808)
  • Fixed Height Ring Separator (FHRS) Compatible Canisters

Equipment Compatibility

  • Industry Coin-Stack Packing Equipment
  • Tyvek and Carbon Interleaf Packers
  • Ring Separator Packing Lines
  • Cushion Disk Wafer Separator Packers
  • Existing Coin-Stack Shipping Workflows

Accessories & Packaging

  • Standard Ring Separators (150 / 200 / 300 mm; multiple thicknesses available for 200 mm)
  • Fixed Height Ring Separators (FHRS, self-stacking, patent pending)
  • eFORM Adjustable Platform Spacers (16 mm adjustable, 10/pack)
  • Cushion Disks and Tyvek Interleaf
  • OverPak Outer Shippers (per canister size)

Frequently Asked Questions About the eLX Wafer Canister

Common questions about the eLX Zero-Movement Canister family.

Technical Documentation

Need technical specifications for your project? Technical drawings, datasheets, and 3D models are available upon request.

Contact Engineering