Wafer Interface Materials

ePAK Offers the Full Set of Inter Carrier Materials

  • Interleaf or Wafer Separators

  • High-Purity

  • Conductive materials

  • Tyvek® Interleaf

  • Cushion Disks & Edge Protector

  • Closed Cell Foam (Conductive and Anti-Static Materials)

  • ePAD® cushioning (high purity replacement to foam)

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Wafer Shipping & Handling Catalog

Our catalog covers a wide range of products specifically tailored to handling your wafers. Please contact us if you need custom solutions to your projects.

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