Black plastic wafer frames
Plastic Wafer Frames / 125–300mm

Plastic Wafer Frames

ePAK plastic wafer frames are single-use molded carriers for wafers mounted on dicing tape. The standard range covers 125mm to 300mm (5–12 in) wafers in three material codes: eM-59 glass-reinforced PPS, eM-89 SAN and eM-72, with DISCO- and K&S-compatible outlines on selected sizes.

3 Material Codes
125–300mm Wafer Sizes
13 Frame Types
200 Per Carton
  • ✓
    No Return Logistics
    Single-use frames remove the frame-return and reuse-cleaning step from one-way shipments
  • ✓
    Glass-Reinforced PPS
    11 of 13 order codes use flame-resistant, glass-reinforced PPS (eM-59), injection molded on dedicated tooling
  • ✓
    Dimensional & Visual QC
    eM-59 production includes dimensional and visual checks, multi-step cleaning and a final QA release
  • ✓
    Controlled Edge Finishing
    Gate and flash removal plus edge deburring to limit flaking and particle generation at the frame edge
  • ✓
    DISCO & K&S Outlines
    DISCO- and K&S-compatible outlines on selected 150–300mm (6–12 in) frames
  • ✓
    eM-59 Packaging & Traceability
    Anti-static single or double bagging, order-code labels and QA lot documentation traceable to the molding batch
Black plastic wafer frames
Open single flex frame shippers

Single-Use Plastic Wafer Frames for One-Way Shipments

ePAK plastic wafer frames are intended for single-use (disposable) wafer handling and one-way shipment, which removes frame-return freight and reuse cleaning. ePAK offers 13 standard frame types for 125mm to 300mm (5–12 in) wafers.

Plastic wafer frames, also called plastic flex frames, plastic film frames or plastic tape frames, support wafers mounted on dicing tape. For one-way shipments, the receiving facility can de-tape the wafer and discard the frame; no return shipment or reuse cleaning is needed.

The 13 standard types use three material codes. Eleven are eM-59 PPS wafer frames, molded from black, flame-resistant, glass-reinforced polyphenylene sulfide; the 150mm eOP0209 uses eM-89 SAN, and the 125mm eOP0863 uses material code eM-72 (material data on request).

eM-59 frames are injection molded on dedicated tooling, after which gates and flash are removed and edges are deburred. Dimensional and visual QC, multi-step cleaning, anti-static bagging, order-code labeling and QA lot documentation traceable to the molding batch complete the process.

Standard frame sizes cover 125mm, 150mm, 200mm and 300mm wafers. The 300mm (12-inch) frame, eOP0137, measures 380mm flat-to-flat with a 350mm inner diameter and 3.5mm thickness. DISCO- and K&S-compatible outlines are available from 150mm to 300mm, and a matching single shipper is available for 12 of the 13 frame types.

For reusable in-house handling, see ePAK metal film frames. ePAK also offers frame shippers, canisters, frame-handling FOUP configurations and overPAK™ outer packaging for selected frame sizes.

View Frame Sizes
Framed-wafer flow

From Mounting to One-Way Shipment

ePAK offers frames and supporting handling products across the framed-wafer flow. Components are matched by frame dimensions and capacity; qualification remains customer- and process-specific.

  1. Mount & Dice

    Wafers are mounted on tape in the plastic frame, then diced and handled in back-end steps. The frame outline is matched to each tool.

    Carrier Single-Use Frames
  2. Protect

    Framed wafers travel in single or multi frame shippers and coin-stack canisters, with foam disks and Tyvek separators.

    Shippers Film Frame Shippers & Wafer Frames
  3. Automate

    Frame-handling FOUP configurations carry selected frame formats in automated handling flows.

    FOUP Modular FOUP System
  4. Ship

    Loaded shippers and canisters travel in overPAK™ outer packaging, listed for selected formats.

    Outer packaging overPAK™

Typical Single-Use Frame Applications

Where single-use frames support mounted-wafer handling

One-Way Wafer Shipments

One-Way Wafer Shipments

Shipping diced or mounted wafers to customers and OSATs; the frame is discarded after de-taping at destination.

Wafer Mounting & Taping

Wafer Mounting & Taping

Frames hold the wafer on tape from mounting through dicing and back-end handling.

Dicing & Singulation

Dicing & Singulation

DISCO- and K&S-compatible outlines for dicing saws and common frame-handling automation; the outline is matched to each tool.

Multi-Frame Vertical Shipping

Multi-Frame Vertical Shipping

25 frames per multi-shipper for 150 and 200mm; 13 frames with a 3.5mm spring for 300mm plastic frames.

Coin-Stack Canister Shipping

Coin-Stack Canister Shipping

Framed wafers ship horizontally in coin-stack canisters with foam cushion disks and Tyvek® separators.

300mm Back-End Processing

300mm Back-End Processing

Dicing and back-end handling of 300mm (12-inch) wafers on tape using the 380mm eOP0137 frame.

Compatibility & Integration

Frame outlines, equipment and the packaging ecosystem around them

Frame Geometries

  • ✓ DISCO DTF 2-6 / 2-6-1 / 2-8-1 compatible outlines (195–276mm flat-to-flat)
  • ✓ K&S 350-103 / 350-104 compatible outlines
  • ✓ 300mm frame: 380mm flat-to-flat / 350mm inner diameter

Equipment Categories: Confirm per Tool

  • ✓ Dicing saws using DISCO DTF or K&S 350-series frame outlines
  • ✓ Tape mounters
  • ✓ Frame-handling automation

Packaging & Ecosystem

  • ✓ Single flex frame shippers (clamshell and tray style)
  • ✓ Vertical multi-shippers: 25 frames for 150/200mm; 13 frames for 300mm
  • ✓ Coin-stack frame canisters
  • ✓ Foam cushion disks and Tyvek separators
  • ✓ Moisture-barrier bags
  • ✓ overPAK™ outer packaging

Specifications

Technical specifications and ordering information.

Plastic Wafer Frame Sizes
184mm flat-to-flat (125mm) 160mm inner diameter, 1.8mm thick, eM-72
195mm (150mm) 174mm inner diameter, 2.0mm thick, PPS
212mm (150mm) 194mm inner diameter, 2.0mm thick, PPS
215.9mm (150mm) 185mm inner diameter, 2.2mm thick, SAN
216mm (150mm) 185mm inner diameter, 2.2mm thick, PPS
217mm (150mm) 194mm inner diameter, 2.5mm thick, PPS (two versions)
266mm (200mm) 242mm inner diameter, 2.6mm thick, PPS
275mm (200mm) 250mm inner diameter, 2.4mm thick, PPS
276mm (200mm) 250mm inner diameter, 2.0 or 2.6mm thick, PPS (three versions)
380mm (300mm) 350mm inner diameter, 3.5mm thick, PPS
eM-59 Molding & Finishing
Material Flame-resistant, glass-reinforced PPS, black (eM-59-BLK)
Molding Injection molding on dedicated tooling
Edge condition Gates and flash removed, edges deburred
Quality control Dimensional and visual checks; final QA release before shipment
Cleaning Multi-step cleaning and particulate control
Packaging & Logistics
Standard pack 200 frames per carton (all 13 order codes)
Bagging eM-59: anti-static bags, single or double bagged
Labeling eM-59: order-code labels; QA lot documentation traceable to the molding batch
Intended use Single use (ship, de-tape, discard)

Planning a one-way wafer shipment?

Contact our team for samples, outline drawings or volume pricing.

Contact Sales

Frequently Asked Questions About Plastic Wafer Frames

Common questions about sizes, materials and use

Technical Documentation

Need technical specifications for your project? Technical drawings, datasheets, and 3D models are available upon request.

Contact Engineering