Metal Wafer Frames for Dicing and Backend Handling
ePAK metal film frames are stainless steel wafer frames for mounting, dicing and transporting wafers on tape. DISCO and K&S outlines cover 150mm through 300mm wafers and the catalog adds a 450mm frame. Finish options are high polish or electropolish (EP), confirmed per outline.
A metal film frame is the stainless steel ring that supports a wafer mounted on dicing tape through singulation and backend handling. The frame outline gives saws, tape mounters and handling equipment a defined geometry for locating the taped wafer.
Production runs from press or laser cutting and initial inspection through stress relief and hardening, edge polishing and surface-finish control, with surface Ra sampled and verified every 100 units. Frames are then cleaned in multi-stage ultrasonic baths, dried and visually inspected, marked where specified, vacuum-sealed and released by QA.
The finish, high-polish or electropolished (EP), is selected per customer drawing and qualification; other finishes are available on request.
Standard outlines follow DISCO DTF 2-6-1, 2-8-1 and 2-12 and K&S 350-103 and 350-104 geometries for 150mm (6-inch), 200mm (8-inch) and 300mm (12-inch) wafers. A 556mm flat-to-flat frame covers 450mm applications, and custom metal wafer frames in other sizes and shapes are available on request.
Frames ship vacuum-sealed. Keep the packaging sealed until use and store frames in a dry environment. Metal frames are intended for reuse.
For transport and storage, ePAK also supplies single and multi-frame shippers, coin-stack canisters and overPAK™ outer packaging for 150–300mm framed wafers.
