One FOUP Platform for Every Wafer Format
The eFOUP-C is ePAK's modular FOUP system, a configurable 300mm wafer carrier designed to unify wafer transport for fabs managing 200mm wafers, 300mm wafers, and film frames within a single carrier platform.
Semiconductor fabs increasingly handle multiple wafer formats across their production lines. The modular FOUP addresses this challenge with a single 300mm shell that accepts precision-molded, application-specific inserts. Each insert adapts the carrier for a different substrate, from standard and thinned 300mm wafers to 200mm wafers and 276mm film frames, while maintaining the same external dimensions and automation interfaces.
The modular 300mm FOUP preserves full SEMI/FIMS compliance, including SEMI E62 mechanical interfaces and kinematic coupling for repeatable load port placement. Existing AMHS infrastructure, overhead hoists, automated guided vehicles, and stockers, works without modification regardless of the internal insert configuration. The static dissipative carbon fiber polycarbonate shell and PEEK door components provide ESD protection and low outgassing across all configurations.
With six available insert configurations and options for handles, RFID integration, card holders, and rear window variants, ePAK tailors each eFOUP-C system to match your specific process requirements. Looking for a standard single-format FOUP? View ePAK’s standard FOUP carrier. Contact ePAK to discuss which modular FOUP configuration best fits your fab’s multi-format handling needs.
