eCT-SQ square single panel shippers with clear PC and black lids
eCT-SQ square single panel shippers with clear PC and black lids
eCT-SQ310 Square Single Shipper for 310 x 310mm glass panels, clear PC
eCT-SQ320 square panel shipper for 320 x 320mm panels, black
eGBX round glass shippers, closed
eGBX round glass shipper, open base and cover with slots
Engineered Solutions · Glass Substrate Handling

Glass Substrate Carriers

ePAK glass substrate carriers cover square single shippers for 310 x 310mm and 320 x 320mm panels, eGBX shippers for round glass substrates and process cassettes for rectangular and square glass. Retention, contact zones and qualification are defined per program.

  • ✓
    Defined Product Scope
    Square single shippers for 310 x 310mm and 320 x 320mm panels, round glass shippers and glass cassettes, plus wafer handling platforms that can be assessed for glass wafers. Other formats start with an engineering review.
  • ✓
    Substrate-Specific Support
    Contact zones and support geometry are developed around the customer's glass type, stack, thickness, mass, bow and permitted edge or back-side contact.
  • ✓
    Interface-Led Engineering
    Load-port, robot, AMHS and other automation requirements are reviewed against the customer's actual interface drawings. Compatibility is confirmed per configuration.
  • ✓
    Qualification by Use Case
    Cleanliness, outgassing, ESD, shock, vibration and environmental requirements are converted into project-specific acceptance criteria and test plans.
View Product Scope Contact Application Engineering
eCT-SQ320 square panel shipper for 320 x 320mm panels, black
eGBX round glass shipper, open base and cover with slots

Glass Requires Application-Specific Handling

Glass may serve as a permanent glass core, a TGV or interposer substrate, or a temporary process carrier. The ePAK product is the transport, storage or automation carrier around that substrate, not the glass substrate itself.

Glass is not a single handling specification. Brittle edges, restricted contact areas, substrate bow, contamination limits and shipment conditions all affect carrier design.

Different glass roles require different carriers. A temporary glass process carrier supports a wafer or panel during fabrication and is later debonded. A permanent glass-core substrate remains in the package. A TGV panel or glass interposer carries interconnect structures. ePAK develops the separate transport, storage or automation carrier used around these substrates between process or logistics steps.

ePAK starts with the actual substrate and process specification. The product scope includes square single shippers for 310 x 310mm and 320 x 320mm panels, eGBX shippers for round glass substrates and cassettes for rectangular and square glass; a Quarter FOUP for 310 x 310mm panels is in development. Existing round-wafer platforms and requests for other panel sizes are reviewed case by case; they are not presented as universally glass-qualified products.

Qualification is configuration-specific. Each program defines permitted contact zones, substrate thickness and mass, capacity, manual or automated handling, and the required shipping environment. Applicable interface drawings and test criteria are agreed with the customer. Cleanliness, ESD, material, automation and shipment performance are confirmed only for the tested product revision and configuration.

Product Scope

ePAK Glass-Handling Products

Shippers and cassettes for glass panels and round and rectangular glass, plus wafer handling platforms that can be assessed for glass wafers. Retention, contact zones, pack-out and qualification are confirmed per program after application review. In development: Quarter FOUP 310 x 310, a front-opening carrier for 25 panels of 310 x 310mm. Tooling started September 2026.

Glass Panels

310 / 320mm Square Panel Shippers 310 and 320
Panel Shipping Product

Square Panel Shippers 310 and 320

One panel per shipper, base with separate cover

Coinstack-style single shippers for 310 x 310mm and 320 x 320mm glass and silicon panels, with 16 cushion pads and a gasket between lid and base. Both sizes share outside dimensions of 381 x 379 x 40mm. Clear PC, conductive PC or a black version; washed as standard, as-molded on request.

  • 310 or 320mm panels
  • 381 x 379 x 40mm
  • 10 per carton

Round and Rectangular Glass

eGBX eGBX Round Glass Shippers
Round Glass Shipper

eGBX Round Glass Shippers

160, 170 and 180mm round glass substrates

Shippers for round glass substrates: up to 20 substrates of 160 x 1.65mm or 180 x 1.65mm per shipper, and a single-substrate box for 170 x 1.5mm. Adapter plates in ABS or PS.

  • 160 / 170 / 180mm
  • 1 or 20 per shipper
  • Adapter plates ABS/PS
Cassettes Rectangular and Square Glass Cassettes
Process Cassettes

Rectangular and Square Glass Cassettes

180 x 230mm and 156 x 156mm substrates

A 25-slot cassette for 180 x 230mm glass in conductive PP or PVDF, with a matching storage box, and a 25-slot process boat for 156 x 156mm square substrates in PVDF, PP in six colors or conductive PP.

  • 180 x 230 / 156 x 156mm
  • 25 slots
  • PP, conductive PP or PVDF

Wafer Platforms and Custom

Application review Round-Glass Wafer Handling
Existing Platform Assessment

Round-Glass Wafer Handling

Assessment of existing ePAK wafer handling platforms

Existing ePAK platforms such as ePRO shipping boxes, single wafer shippers, canisters, jars and process boats may provide a starting point for glass wafers or bonded stacks. Suitability is assessed from diameter, stack, thickness, mass, bow, contact restrictions and handling environment.

  • Existing platforms
  • Glass wafers and stacks
  • Application review
Engineered to order
Custom Engineering

Other Panel and Substrate Formats

Feasibility review before product definition

Other panel sizes, bonded stacks, glass interposers and TGV panels begin with application engineering. Material set, pocket geometry, contact zones, capacity, interface and qualification are defined per project.

  • Per application
  • Drawing on request
  • Engineering review
Start an engineering review
Engineering Workflow

How a Glass-Handling Program Is Defined

Each program moves from a verified substrate requirement to a configuration-specific design and qualification record.

  1. Requirements Review

    Confirm format, tolerances, glass stack, thickness, mass, bow, permitted contact zones, capacity and handling environment.

    Output Requirements set

  2. Concept & Contact Strategy

    Define support geometry, orientation, retention, pack-out and material candidates around the substrate specification.

    Output Concept definition

  3. Interface Review

    Review the actual load port, robot, AMHS/OHT, manual handling and identification interfaces that apply to the program.

    Output Interface matrix

  4. Prototype & Qualification

    Build and evaluate the agreed revision against program-specific mechanical, cleanliness, ESD and shipment criteria.

    Output Test record

  5. Release by Configuration

    Record the qualified product revision, load, interface, packaging configuration and permitted use conditions.

    Output Approved revision

Typical Glass Substrate Carrier Applications

Where ePAK configures carrier and shipper products for glass workflows.

310 and 320mm Panel Shipping

310 and 320mm Panel Shipping

Square single shippers carry one 310 x 310mm or 320 x 320mm glass or silicon panel each for advanced packaging workflows. Contact zones, pack-out and shipment qualification are defined per program.

Round Glass Substrates

Round Glass Substrates

eGBX shippers for 160, 170 and 180mm round glass substrates, one per box for 170mm or up to 20 per shipper for 160 and 180mm.

Rectangular and Square Glass

Rectangular and Square Glass

25-slot cassettes for 180 x 230mm glass and 156 x 156mm square substrates, with a storage box for the 180 x 230mm cassette.

Glass Wafers and Bonded Stacks

Glass Wafers and Bonded Stacks

Existing round-wafer platforms, bonded stacks, glass interposers and other formats are assessed through an engineering feasibility review; glass-specific suitability is not assumed.

Standards, Interfaces and Qualification

Relevant standards are engineering inputs with different scopes; they do not create blanket product certification or equipment compatibility.

Interface Review

  • ✓ No generic compatibility is claimed for a named load port, OHT, AMHS, robot or end effector.
  • ✓ The exact equipment model, interface drawing, payload, orientation and transfer sequence are reviewed per project.
  • ✓ Interoperability is stated only after the applicable review or test has been completed for the specific revision.
  • ✓ RFID requirements can be reviewed where identification is part of the project scope.

Program Qualification

  • ✓ Cleanliness, outgassing, ESD, material, purge and environmental requirements are agreed as project criteria.
  • ✓ External shipment requirements may include project-specific shock, vibration, drop and climate profiles.
  • ✓ Results apply only to the tested product revision, load and packaging configuration.
  • ✓ Configuration, acceptance criteria and evidence are recorded in the qualification file.

Frequently Asked Questions

Clear answers about ePAK's glass-handling product scope.

Technical Documentation

Need technical specifications for your project? Technical drawings, datasheets, and 3D models are available upon request.

Contact Engineering

Developing a glass-substrate handling flow?

Share the substrate format, stack, thickness, mass, contact restrictions, interface and shipping environment. ePAK will confirm whether a program-specific product, an existing platform review or a custom engineering solution is appropriate.

Request Engineering Review View Product Scope