Coin style single wafer shippers with natural lids on black bases
Coin style single wafer shippers with natural lids on black bases
150mm InP coin shipper with spider spring, open
eInP: Indium Phosphide Wafer Handling - Image 3
eInP: Indium Phosphide Wafer Handling - Image 4
Process boats for in-fab wafer transport
Film frame shippers, canisters and wafer frames
eInP: Indium Phosphide Wafer Handling - Image 7
Solution Line · Indium Phosphide

eInP: Indium Phosphide Wafer Handling

Carriers and shipping solutions engineered for indium phosphide, from raw wafer to diced die on tape frame: coin shippers for one high-value wafer at a time, process carriers, tape frames and frame shippers, and hoop ring shippers for diced InP.

  • ✓
    Edge-Only Capture
    The 150mm InP coin shipper captures only the outside edge of the wafer, with no contact on the wafer surface; wider spider legs fit into recessed cavities to prevent movement.
  • ✓
    One Wafer at a Time
    Coin shippers for 150mm and 3 inch InP wafers, and the standard coin style range from 1 to 6 inch.
  • ✓
    Diced InP on Frames and Rings
    Metal tape frames for DISCO 2-6-1 with frame shippers, and hoop ring shippers for one 140/152 ring set or 13 rings.
  • ✓
    If It Does Not Exist, ePAK Engineers It
    Custom diameters as standard practice, including 152mm, 154mm and 159mm carrier wafers.
Request Quote Contact ePAK
150mm InP coin shipper, black
Section through an InP coin shipper: the cushion captures the wafer edge

What Indium Phosphide Asks of a Carrier

InP wafers are brittle, small in diameter and high in value, and their device side is easily degraded. These properties drive the design of ePAK's InP carriers.

Brittle by nature. Fracture toughness well below silicon. InP cleaves readily along crystal planes: a point load or edge knock that silicon withstands can shatter it. Our answer: edge-only capture, recessed seats and constrained movement in transit.

Small diameters, high value. InP wafers run from 50mm to 150mm in diameter, and each wafer carries high value. One broken wafer inside a multi-wafer shipper can ruin the entire lot. Our answer: single wafer coin shippers that protect one high-value wafer at a time.

Mirror-finish device side. Particles, outgassing residues or ESD degrade laser facets and detector responsivity, and damage is often invisible until wafer-level test. Our answer: the 150mm coin shipper holds the wafer by its outside edge only, with no contact on the wafer surface, and conductive PP (10⁴–10⁵ Ω/sq) is available as a material option.

Solution line

Products in the eInP Line

Start from what you are handling: raw wafers to ship, wafers in the fab, wafers on tape frames, or diced die on hoop rings. Specifications for the InP coin shippers, the multi hoop ring shipper and the DISCO 2-6-1 tape frame follow further down the page.

Production Journey

Coverage Across the InP Process Chain

Four steps, from raw wafer intake and inter-fab transfer to diced die transport, each with its own carrier.

  1. Raw Wafer Intake & Inter-Fab Transfer

    Raw InP wafers ship one at a time in coin shippers, with InP versions for 150mm and 3 inch wafers.

    Carrier Coin Shippers

  2. In-Fab Moves & Wet Process

    PFA cassettes, process carriers and process boat storage boxes move wafers between process steps.

    Carrier Process Carriers

  3. Dicing & Singulation

    Wafers are mounted on metal tape frames for DISCO 2-6-1 and ship in single, multi or canister frame shippers.

    Carrier Tape Frames & Frame Shippers

  4. Diced Die Transport

    Diced InP on 140/152 hoop rings moves between sites in single hoop ring shippers or in the 13-ring multi hoop ring shipper.

    Carrier Hoop Ring Shippers

Formats, Materials & Cleanliness

Wafer and frame formats the eInP products cover, the materials they come in, and how they are cleaned and packed.

Wafer & Frame Formats

  • ✓ InP wafers from 50mm to 150mm in diameter
  • ✓ InP coin shippers for 150mm and 3 inch (76mm) wafers
  • ✓ Coin style shippers for 1 to 6 inch wafers, including 4 inch InP, and a 6 inch version for 153 / 155mm wafers
  • ✓ Metal tape frames for DISCO 2-6-1 (150mm wafers)
  • ✓ 140/152 hoop rings for diced die

Materials

  • ✓ Natural PP, natural PP in V4 grade or conductive PP (150mm)
  • ✓ Clear PC lid and base with a cross-shaped PBT spring (3 inch)
  • ✓ Conductive PP 10⁴–10⁵ Ω/sq; natural PP and clear PC are not conductive
  • ✓ Single frame and hoop ring shippers in conductive PS, clear PS or anti-static coated PS
  • ✓ 140/152 hoop rings in MPC

Cleanliness & Packing

  • ✓ 150mm InP coin shipper washed and packed in a Class 10K or better environment
  • ✓ Multi hoop ring shipper washed as standard
  • ✓ As-molded versions available
  • ✓ Coin style shippers 100 per carton; MASTERPAK outer packaging with antistatic PE foam for 2, 3, 4 and 6 inch
  • ✓ overPAK sets for frame multi-shippers, frame canisters and the multi hoop ring shipper

Specifications

Technical specifications and ordering information.

InP Coin Shipper, 150mm
Wafer size 150mm
Wafers per shipper 1
Outside dimensions Ø170.0 x 21.0mm
Lid and base Natural PP, natural PP V4 grade or conductive PP
Spring Spider spring with wider legs, same material as lid and base
Wafer contact Outside edge only; no contact on the wafer surface
Closure Positive lock
Surface resistivity Conductive PP 10⁴–10⁵ Ω/sq; natural PP not conductive
Cleanliness Washed and packed in a Class 10K or better environment; as-molded version available
InP Coin Shipper, 3 inch
Wafer size 3 inch (76mm)
Wafers per shipper 1
Outside dimensions Ø90.4 x 13.5mm
Lid and base Clear PC, not conductive
Spring Cross-shaped spring in PBT
Multi Hoop Ring Shipper, 140/152
Hoop rings 13, size 140/152
Outside dimensions 209.2 x 220.0 x 205.1mm
Parts Lid, base, spring
Material Conductive PP
Surface resistivity 10⁴–10⁵ Ω/sq
Interface Automation interface
Cleanliness Washed as standard; as-molded version available
Outer packaging overPAK available
Metal Tape Frame, DISCO 2-6-1 (150mm wafers)
Material 420 stainless steel
Flat to flat 212mm
Internal diameter 194mm
Frame thickness 1.22mm
Finishes High-polish or electropolished (EP); other finishes and custom sizes on request
Frames per carton 50
Multi-shipper 25 frames, vertical, conductive PP or natural PP
Frame canister 40mm internal height, conductive PP
Coin Style Shippers: Wafer Thickness with Spring
2 inch (50mm), 52mm internal 0.2–1.0mm
2.5 inch (63mm), 65.5mm internal 0.2–1.2mm
3 inch (76mm), 78.6mm internal 0.2–1.2mm
3.25 inch (82mm), 85mm internal 0.2–1.2mm
3.54 inch (90mm), 92mm internal 0.2–1.2mm
4 inch (100mm), 104mm internal 0.2–1.5mm
4 inch thin-wafer version, 100.6mm internal wafers 0.08–0.6mm
5 inch (125mm), 127mm internal 0.2–1.2mm
6 inch (150mm), 152mm internal 0.2–1.0mm
Used without a spring a wafer thicker than the maximum with spring can rattle in the shipper and cause chipping or particles in shipping

Frequently Asked Questions About InP Wafer Handling

Common questions from process, packaging and purchasing engineers handling InP wafers and diced InP.

Technical Documentation

Contact Engineering
PDF
ePAK Wafer Handling Catalog
ePAK-Wafer-Catalog-2025A3.pdf

Specifying carriers for InP wafers?

Send us the wafer spec and the handling flow; we come back with a carrier proposal. Samples, drawings and 3D CAD models (STEP) are available on request.

Request a Carrier Proposal Technical Documentation