FOUP 300mm Wafer Carrier
What is a FOUP? The Standard Carrier for 300mm In-Fab Wafer Transport
A FOUP (Front Opening Unified Pod) is a SEMI-standard carrier used to transport and store 300mm semiconductor wafers within a fabrication facility. FOUPs interface directly with load ports and automated material handling systems (AMHS), enabling contamination-free wafer transfer between process tools in a cleanroom environment.
The ePAK eFOUP is a SEMI/FIMS-compliant 300mm FOUP with 25 slots, multiple purge options, and full AMHS compatibility. Built from ultrapure, low-outgassing materials with a robust wafer retention system, the eFOUP minimizes particle generation and contamination risk throughout in-fab transport and storage.
Need to handle multiple wafer formats in a single carrier? View the modular eFOUP-C system with six configurable inserts for 300mm, 200mm, film frames, and probe cards.
Download Catalog Contact UsFOUP Technology Overview
Key Features- SEMI/FIMS compliant
- AMHS compliant
- Automated operation minimizes potential contamination from human interaction
- Automation compatibility for opening and closing
- Ultrapure, low outgassing materials protect wafers
- Robust wafer retention ensures reduced particle generation
- Multiple purge position options
- Multiple handle options
- Multiple window options
- Coupling plates for positioning the FOUP on a load port and enabling transfer by the AMHS
FOUP Specifications
- Wafer size – 300mm
- Capacity – 25 slot
- All datums established relative to kinematic coupling per SEMI
- Wafer spacing – 10mm (+/-0.5mm wafer-to-wafer, non-cumulative)
- Weight (empty) – 4.6 kg; 25 wafer loaded in, about 7.8kg
- Overall size w/ handles and robotic flange : W420 X L342 X H338(mm)
- Overall size w/o handles and robotic flange : W388 X L342 X H332(mm)
FOUP Features
Environmental Control and Purge OptionsPurge Systems: Offers purge options with two or four ports to maintain inert atmosphere conditions, replacing ambient air with nitrogen to protect wafers from oxidative damage. Additionally, a FOUP stocker can be used for managing and storing FOUPs, applying purge gas to increase device yield.
While FOUPs are designed for 300mm wafers, SMIF pods are suitable for wafers with dimensions smaller than 300mm. Both systems play a crucial role in maintaining cleanliness and reducing particle contamination during the handling of silicon wafers.
ESD Protection: Integrated features for electrostatic discharge protection, critical for maintaining the integrity of wafers during storage and transport.
Frequently asked questions
What is a FOUP?
What is the difference between FOUP (front opening unified pod) and a FOSB (front opening shipping box)?
| FOUP | FOSB | |
|---|---|---|
| Primary use | In-fab wafer transport & storage | Inter-fab wafer shipping |
| Wafer size | 300mm | 300mm |
| Transport type | AMHS (automated, within cleanroom) | Manual / logistics (between sites) |
| Environment | Cleanroom (ISO Class 1-3) | Controlled packaging for transit |
| Purge capability | N₂ purge via 2 or 4 ports | Purge valves for inert atmosphere |
How many wafers can a FOUP hold?
What is the difference between FOUP and SMIF pods?
Wafer Shipping & Handling Catalog
Our catalog covers a wide range of products specifically tailored to handling your wafers. Please contact us if you need custom solutions to your projects.