Matrix Trays
ePAK manufactures precision-molded matrix trays for the safe handling, shipping, and storage of semiconductor components. Our tray solutions cover JEDEC, EIAJ, and fully custom outlines, all produced with ESD-safe materials to protect sensitive devices throughout the supply chain.
- JEDEC, EIAJ, and custom tray outlines
- Wide range of materials available to meet your ESD and process requirements
- Patented eBIN™ lot and process identification system
- Patented V-Cut™ tray designs
- Modular insert-tray system for flexible device handling
JEDEC Tray Specifications & Technology
JEDEC, EIAJ & Custom Tray Outlines
Our matrix tray program supports all standard JEDEC and EIAJ tray outlines, as well as custom configurations for components with unique form factors. Whether you need standard QFP, BGA, or SOP pocket formats, or a fully custom cavity layout, ePAK engineers each tray to match your device specifications with tight dimensional tolerances. All trays are available in a wide range of materials to meet your ESD and process requirements.
Patented eBIN™ & V-Cut™ Technology
ePAK's proprietary eBIN™ technology provides a modular insert-and-tray system that allows multiple device types to be handled in a single tray frame. The patented V-Cut™ feature enables clean separation of tray sections without tooling, simplifying downstream sorting and kitting operations. Both technologies are designed to reduce inventory complexity while maintaining full device protection.
Modular Insert-Tray System
The ePAK modular tray system uses interchangeable inserts within a standard outer frame. This approach minimizes the number of unique tray SKUs required, while offering the flexibility to accommodate new device outlines as your product portfolio evolves. Inserts can be swapped quickly, reducing changeover time in automated pick-and-place and test handler environments.
